Two learning tracks tailored for participants with different academic backgrounds.
Hands-on demonstrations in semiconductor packaging technologies.
Lectures from semiconductor leaders and former TSMC researchers.
Visit Hsinchu Science Park and leading semiconductor companies.
| Location | Taipei & Hsinchu, Taiwan |
|---|---|
| Organisers |
National Taiwan University of Science and Technology (NTUST) Research & Prototype Foundry – University of Sydney |
| Sponsors |
Semiconductor Sector Service Bureau (S3B) |
June 21 – June 25, 2027
Participants with semiconductor background.
June 28 – July 2, 2027
Participants new to semiconductor technology.
Chee Wah LOY (Aaron)
Education Technical Support Officer | Research & Prototype Foundry
rpf.education@sydney.edu.au
+61 452 502 801
Rm 4025, Sydney Nanoscience Hub A31 | The University of Sydney | NSW | 2006
Carrie Hsu
Administrative Specialist
High Speed 3D Printing Research Center, Taiwan Tech
carrie@mail.ntust.edu.tw
+886 2 2737-6714
No. 43, Sec. 4, Keelung Rd., Da’an Dist., Taipei City 106335, Taiwan (R.O.C.)
National Taiwan University of Science and Technology
No. 43, Sec. 4, Keelung Rd., Da'an Dist., Taipei City 106335, Taiwan (R.O.C.)