Day 1 · 28 June 2027
9:00–10:30
Taipei to Hsinchu
10:30–12:00
TSMC Show Room (TSMC Museum of Innovation)
12:30–13:00
TSMC to Yang-Min Chiao-Tung University
13:00–15:00
Visit Yang-Min Chiao-Tung University about IC Design Lab, IC fabrication Lab and IC packaging Lab.
15:30–17:00
NTHU EUV Lab
Prof. MC Chen
17:00–17:30
Hsinchu Science Park city tour
17:30–19:00
Hsinchu to Taipei
Day 2 · 29 June 2027
9:00–16:30
1st Lab and co-packaging demonstration. in NTUST(Hwahsia campus)
Day 3 · 30 June 2027
9:00–10:30
Overview of Taiwan Semiconductor Industry
Jeng NTUST Professor
10:30–12:00
Lecture from Dr. Ma
Chairman of Openness Specialty Materials Corp. Ltd
12:00–13:00
Hsinchu to Hukou
13:00–15:00
Industry visit: Forcera
15:45–17:30
Industry visit: Actron
17:30–18:30
Hukou to Taipei
Day 4 · 1 July 2027
9:00–16:30
2nd Lab and co-packaging demonstration. in NTUST(Hwahsia campus)
Day 5 · 2 July 2027
9:00–10:30
Silicone Photonics for Advanced Packaging
Prof. SH Hsu
10:30–12:00
Lecture from Dr. Yang
Former TSMC R&D Director
13:00–14:00
NTUST Lab visit: Heterogeneously-integrated Silicon Photonic Integration Center & Sustainable Electrochemical Energy Development Center
14:00–15:30
Overview of Australia Semiconductor Industry and Potential Cooperation with Taiwan
Dr Nadia Court (S3B Director)
15:30–17:00
Ceremony and Feedback of bootcamp
18:00–21:00
Dinner in Din Tai Fung
Tentative 2027 program. Dates, activities, times, speakers, and venues may change; the latest announcements will apply.