Two learning tracks tailored for participants with different academic backgrounds.
Hands-on demonstrations in semiconductor packaging technologies.
Lectures from semiconductor leaders and former TSMC researchers.
Visit Hsinchu Science Park and leading semiconductor companies.
| Location | Taipei & Hsinchu, Taiwan |
|---|---|
| Organisers |
National Taiwan University of Science and Technology (NTUST) Research & Prototype Foundry – University of Sydney |
| Sponsors |
Semiconductor Sector Service Bureau (S3B) CruxML AMRF (TBC) |
June 22 – June 26, 2026
Participants with semiconductor background.
June 29 – July 3, 2026
Participants new to semiconductor technology.
Carrie Hsu
02-2737-6714
carrie@mail.ntust.edu.tw
National Taiwan University of Science and Technology
No. 43, Sec. 4, Keelung Rd., Da'an Dist., Taipei City 106335, Taiwan (R.O.C.)