The 2nd Taipei-Sydney Semiconductor Bootcamp 2026
Proposed Schedule of Group A (TBD by NTUST)
|
Day |
Time |
Activity |
|
Day 1 22 June 2026 |
9:00-10:30 |
Taipei to Hsinchu |
|
10:30-12:00 |
TSMC Show Room (TSMC Museum of Innovation) |
|
|
12:30-13:00- |
TSMC to Yang-Min Chiao-Tung University |
|
|
13:00-15:00 |
Visit Yang-Min Chiao-Tung University about IC Design Lab, IC fabrication Lab and IC packaging Lab. |
|
|
15:30-17:00 |
NTHU EUV Lab. Prof. MC Chen |
|
|
17:00-19:00 |
Hsinchu to Taipei |
|
|
Day 2 23 June 2026 |
9:00-16:30 |
1st Lab and co-packaging demonstration in Lungwha |
|
Day 3 24 June 2026 |
9:00-10:30 |
Bootcamp opening and Global Semiconductor Industry: Eric Huang Digitimes Vice President |
|
10:30-12:00 |
Overview of Taiwan Semiconductor Industry: Jeng NTUST Professor |
|
|
12:00-13:00 |
Hsinchu to Hukou |
|
|
13:00-15:00 |
Industry visit: Forcera, Skytech |
|
|
15:45-17:30 |
Industry visit: Actron |
|
|
17:30-18:30 |
Hukou to Taipei |
|
|
Day 4 25 June 2026 |
9:00-16:30 |
2nd Lab and co-packaging demonstration in Lunghwa University |
|
Day 5 26 June 2027 |
7:30-9:00 |
Taipei to Hsinchu |
|
9:00-12:00 |
Globalwafers, Scientech |
|
|
12:00-13:00 |
Hsinchu to Taipei |
|
|
13:30-16:30 |
Dr Nadia Court (S3B Director): Overview of Australia Semiconductor Industry and Potential Cooperation with Taiwan |
|
|
13:30-15:00 |
Lecture from Dr. Yang Former TSMC R&D Director |
|
|
15:30-17:00 |
Ceremony and Feedback of bootcamp |
|
|
18:00-21:00 |
Dinner in Din Tai Fung |
** All Schedule details are subject to change at the organizer’s discretion. The latest announcements shall prevail.
Proposed Schedule of Group B (TBD by NTUST)
|
Day |
Time |
Activity |
|
Day 1 29 June 2026 |
9:00-10:30 |
Bootcamp opening and Global Semiconductor Industry: Eric Huang Digitimes Vice President |
|
10:30-12:00 |
Overview of Taiwan Semiconductor Industry: Jeng NTUST Professor |
|
|
12:00-13:00 |
Hsinchu to Hukou |
|
|
13:00-15:00 |
Industry visit: Forcera, Skytech |
|
|
15:45-17:30 |
Industry visit: Actron |
|
|
17:30-18:30 |
Hukou to Taipei |
|
|
Day 2 30 June 2026 |
9:00-16:30 |
1st Lab and co-packaging demonstration in Lunghwa University |
|
Day 3 1 July 2026 |
9:00-10:30 |
Taipei to Hsinchu |
|
10:30-12:00 |
TSMC Show Room (TSMC Museum of Innovation) |
|
|
12:30-13:00- |
TSMC to Yang-Min Chiao-Tung University |
|
|
13:00-15:00 |
Visit Yang-Min Chiao-Tung University about IC Design Lab, IC fabrication Lab and IC packaging Lab. |
|
|
15:30-17:00 |
NTHU EUV Lab. Prof. MC Chen |
|
|
17:00-19:00 |
Hsinchu to Taipei |
|
|
Day 4 2 July 2026 |
9:00-16:30 |
2nd Lab and co-packaging demonstration in Lungwha |
|
Day 5 3 July 2026 |
7:30-9:00 |
Taipei to Hsinchu |
|
9:00-12:00 |
Globalwafers, Scientech |
|
|
12:00-13:00 |
Hsinchu to Taipei |
|
|
13:30-16:30 |
Dr Nadia Court (S3B Director): Overview of Australia Semiconductor Industry and Potential Cooperation with Taiwan |
|
|
13:30-15:00 |
Lecture from Dr. Yang Former TSMC R&D Director |
|
|
15:30-17:00 |
Ceremony and Feedback of bootcamp |
|
|
18:00-21:00 |
Dinner in Din Tai Fung |
** All Schedule details are subject to change at the organizer’s discretion. The latest announcements shall prevail.